CMP & Polishing Materials
Your Reliable CMP & Polishing Materials Manufacturer
In fields such as semiconductor chips and precision optics, any minor unevenness can be fatal, with consequences including failed photolithography, short circuits in wiring, or inability to stack. The main function of CMP & Polishing Materials is to achieve global nanoscale planarization of the surface. It is not merely a grinding process; rather, it is more about the precise synergy of chemistry and mechanics.
KOSNANO offers high-performance CMP & Polishing Materials
A considerable portion of KOSNANO’s products are core raw Materials in the CMP & Polishing Materials field. The absolute main force of nano-silicon oxide metal CMP. Mainly used for CMP of copper and tungsten. Its hardness is moderate. Nano-alumina, high-hardness abrasive. It is used for polishing hard materials, such as sapphire substrates, certain metal alloys and crystals. Nano zirconia, high-hardness and high-toughness abrasive. Its toughness can reduce self-breakage during the polishing process and maintain a stable particle size. However, some materials are not directly used as the main abrasives. For instance, our nano-titanium oxide, nano-magnesium oxide and nano-iron oxide influence the polishing process through chemical and physical actions.
The factors can affect CMP & Polishing Materials
The core factors to be considered when selecting raw Materials for CMP and Polishing Materials include particle size distribution, which must be extremely narrow to prevent large particles from scratching the wafer, whether the particle morphology is uniform, and whether the purity reaches “electronic grade” or “CMP grade”. Hardness, surface chemistry, what kind of object form, powder or dispersion is suitable for the application scenario.
magnesium oxide
Why do customers choose our CMP & Polishing Materials?
The variety is stable, and the raw materials are highly consistent in terms of particle size, purity and performance from batch to batch. Provide detailed technical data sheets and application support. The particle morphology and usage form can be customized. Cost advantage and fast delivery capability. Selecting CMP raw materials is a complex decision-making process that seeks the best balance point among “performance, stability, cost and supply”. KOSNANO is your reliable partner!
