Silica Filler for IC Packaging
High-Purity Spherical Silica Filler for IC & Electronic Packaging
KOSNANO supplies high-purity spherical silica filler for semiconductor and electronic packaging. This IC packaging silica filler is optimized for epoxy molding compounds (EMC), underfill, and copper clad laminates (CCL), with high sphericity, high filler loading, low viscosity, and excellent mold flowability.
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Advanced Spherical Silica Filler Solutions by KOSNANO
| Product Name | Spherical Silica Powder for Electronic Packaging | Material | SiO2 (Silicon Dioxide) |
|---|---|---|---|
| Purity (SiO2) | ≥ 99.9% | Sphericity | ≥ 95% |
| Particle Size Distribution | 0.2 µm – 40 µm, customizable D50 & Dmax | Whiteness | ≥ 95 |
| Electrical Conductivity | ≤ 5 μS/cm | Applications | IC packaging, EMC, underfill, electronic filler |
| Key Controls | Low magnetic impurities, low ionic contaminants (Cl-, Na+), batch COA available | ||
| Packaging | 25 kg/bag | Supply Mode | Bulk supply and sample evaluation available |
Why Choose KOSNANO Spherical Silica Filler?
Minimize CTE
High-purity spherical silica helps match the thermal expansion behavior of epoxy systems and silicon die, reducing packaging cracking and warpage risk.
High Loading & Low Viscosity
Spherical morphology improves flowability and supports 70%-90% filler loading while keeping viscosity manageable for EMC and encapsulant processing.
Narrow-Gap Filling
Controlled D50 and Dmax help achieve void-free filling in advanced flip-chip underfill and dense electronic packaging designs.
Technical Specifications of Our Electronic-Grade Silica Filler
Customized Services
KOSNANO provides high-purity, high-performance specialty powder materials for global customers. Our team relies on advanced production processes and a rigorous quality management system to meet demanding industrial requirements.
Our spherical silica fillers are designed for dispersibility, anti-settling performance, and flowability in resin systems. We can support particle size selection, surface treatment discussion, batch consistency control, and COA-based quality confirmation.
Ask Our EngineersFrequently Asked Questions
Why is spherical silicon micropowder used instead of angular or quasi-spherical silicon powder in IC packaging?
Spherical silicon micropowder has a smaller specific surface area, which significantly increases the filling rate in epoxy resin, often up to 80% or more. At the same time, its rounded shape reduces mold wear and provides excellent flowability, making it an essential choice for high-density integrated circuit packaging.
How do you control magnetic foreign matter and ionic impurities in spherical silica filler?
KOSNANO uses a fully enclosed automated production line equipped with multiple high-intensity magnetic separation systems to strictly control magnetic foreign matter and harmful ions such as Cl-, Na+. Each batch can be supplied with a Certificate of Analysis to support electronic-grade reliability requirements.
Tell Us Your EMC or Underfill Requirements
If you are formulating EMC, underfill, or electronic encapsulants, please provide your D50, Dmax, ionic purity limits, and target filler loading. Our engineers will match the right electronic-grade spherical silica for evaluation.
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