Fused Silica Powder for Semiconductor Filler
High-Purity Fused Silica Powder | 4N9 Spherical SiO2
KOSNANO supplies premium electronic-grade spherical Fused Silica powder for semiconductor encapsulation, EMC, underfill, and high-reliability microelectronics. With 99.99% purity, ≥95% sphericity, low CTE, ultra-low ionic impurities, and custom silane coupling options, this semiconductor filler supports high loading and reliable package performance.
Advanced Semiconductor Encapsulation with High Purity Silica
KOSNANO electronic-grade Fused Silica powder is engineered for next-generation semiconductor encapsulation and high-reliability microelectronics. Using an advanced flame fusion process, high-purity quartz is transformed into spherical silicon dioxide particles with 99.99% (4N9) chemical purity.
This high purity silica filler helps formulators improve packing density, control thermal expansion, and support long-term electrical reliability in demanding epoxy molding compound and underfill systems.
Key Silica Properties & Engineering Performance
Low Ionic Impurities
Strict purification and quality control help reduce ionic impurities and magnetic foreign matter, supporting dielectric strength and long-term reliability in high-voltage or high-frequency circuits.
High Loading, Low Viscosity
Controlled particle size distribution and ≥95% sphericity reduce internal friction, enabling high filling ratios while maintaining strong flow behavior in resin systems.
Lower CTE Stress
High volumetric filling can reduce the coefficient of thermal expansion, helping match silicon chip expansion behavior and prevent warpage, cracking, or delamination.
Technical Specifications & Fused Silica Grades
| Product Name | High purity spherical silicon dioxide / silica micro powder (4N9) | Material | SiO2 (Silicon Dioxide) |
|---|---|---|---|
| Purity | 99.99% (4N9) High Purity Silica | Sphericity Rate | ≥95% |
| Filling Loading | Ultra-high filling capability, up to 90wt% depending on resin system | Surface Treatment | Custom surface treated / modified methods available |
| Whiteness | More than 95% | Silica Applications | Advanced electronic packaging, microelectronic precision filler |
Available Models & Particle Size Distribution (D50)
- 0.5 μm 4N9 spherical silicon dioxide
- 1 μm 4N9 spherical silicon dioxide
- 2 μm 4N9 spherical silicon dioxide
- 3 μm 4N9 spherical silicon dioxide
- 5 μm 4N9 spherical silicon dioxide
- 8 μm 4N9 spherical silicon dioxide
- 10 μm 4N9 spherical silicon dioxide
- 15 μm 4N9 spherical silicon dioxide
- 20 μm 4N9 spherical silicon dioxide
- 30 μm 4N9 spherical silicon dioxide
- 40 μm 4N9 spherical silicon dioxide
Strict Quality Control as a Leading Silica Manufacturer
KOSNANO selects high-purity crystalline quartz raw materials and conducts rigorous purity and mineral structure audits before production. Our in-house laboratory uses Malvern laser particle size analyzers, whiteness meters, and ICP-OES / ICP-MS systems to track particle size consistency and trace metal impurities in every batch.
The production process is completed in a fully enclosed automated line. Final grading, modification, and packaging are carried out in an ISO-certified cleanroom with moisture-proof and anti-static sealed inner packaging to reduce secondary contamination risk.
Frequently Asked Questions Regarding Fused Silica
Why should an engineer choose 4N9 (99.99%) Fused Silica over regular 99.9% silica fillers?
While 99.9% silica may suit basic industrial applications, premium microelectronics require stricter impurity control. KOSNANO 4N9 Fused Silica helps reduce alkali metals and transition metals that may trigger electrochemical migration or leakage over time. It also supports low trace radioactive elements for advanced memory chips and high-reliability electronic packages.
Will custom silane surface modification degrade the chemical purity of the Fused Silica?
No. The surface treatment process introduces ultra-pure, controlled monomolecular silane coupling layers that are cross-linked to the silica surface. It can improve wetting, lower formulation viscosity, and enhance moisture resistance without compromising the 4N9 base purity.
How does KOSNANO guarantee the consistency of particle size distribution across different shipments?
KOSNANO uses automated air-classification technology to control D50, D10, and Dmax. Every batch undergoes mandatory Malvern laser diffraction analysis, helping maintain consistent packing density and flow behavior from sample trials to mass production.
Partner with a Trusted Fused Silica Manufacturer Today
Accelerate your material innovation. If unstable filler grades or ionic contamination are limiting advanced packaging yields, send us your target impurity thresholds, D50 requirements, Dmax limits, and resin chemistry. Our material engineers will match the right high-purity Fused Silica solution for evaluation.